Receptacles for inkjet deposited PLED/OLED devices and method of making the same

ABSTRACT

Evaporated receptacles for inkjet deposited polymeric light-emitting diode (PLED)/organic light-emitting diode (OLED) and a method of making the same. The evaporated receptacles are formed via a shadow mask vacuum deposition process. The method of forming a light-emitting display includes forming an electrode on a substrate, forming a receptacle structure over the electrode via a shadow mask vacuum deposition process, and delivering a quantity of polymeric solution, which contains a light-emitting material, into the receptacle via a standard inkjet deposition process.

FIELD OF THE INVENTION

The present invention relates to an inkjet deposition process forforming polymeric light-emitting diode (PLED) or organic light-emittingdiode (OLED) displays. In particular, the invention relates to formingevaporated receptacles for inkjet deposited PLED/OLED devices.

BACKGROUND OF THE INVENTION

An organic light-emitting diode (OLED) is a light-emitting diode (LED)made of semiconducting organic polymers. These devices promise to bemuch cheaper to fabricate than inorganic LEDs. Varying amounts of OLEDscan be deposited in arrays on a screen by use of simple “printing”methods to create a graphical color display, for use as televisionscreens, computer displays, portable system screens, and in advertisingand information board applications. OLED panels may also be used aslighting devices.

One of the great benefits of an OLED display over the traditional liquidcrystal displays found in computer monitors is that OLED displays do notrequire a backlight in order to function. This means that they draw farless power and can be used with small portable devices, which havemostly made use of monochrome, low-resolution displays, in order toconserve power. This also means that they are able to last for longperiods of time on a single battery charge.

There are two main directions in OLED technology. The first OLEDtechnology was developed by Eastman Kodak Company (Rochester, N.Y.) andis usually referred to as “small-molecule” OLED. The production ofsmall-molecule displays requires a vacuum deposition process, whichmakes the production process expensive and inflexible. A second OLEDtechnology, developed by Cambridge Display Technology (Cambridge, UK),is a polymer-based OLED technology, which is sometimes refered to asPLED technology. Although development of PLED technology lags behind thedevelopment of small-molecule OLED technology by several years, itpromises some advantages. For example, the organic electroluminescentmaterials can be applied on the substrate by a technique derived fromcommercial inkjet printing, which means that PLED displays can be madein a very flexible and inexpensive way.

Producing a multi-color organic display is not an easy task. While theuse of inkjet printing techniques for forming PLED displays has foundsome acceptance in forming displays with larger feature sizes, thetechnique has, so far, depended on a complex and costly photolithographyprocess for forming the receptacles upon the display substrate. Thereceptacles, or wells, are structures that are formed upon a substrateinto which, in the case of a PLED display, the droplets of polymersolution are collected during an inkjet deposition process. What isneeded is a simpler and less costly process for forming receptacles upona display substrate for use in a subsequent inkjet deposition processthat delivers the polymer solvent thereon for completing the displayfabrication.

One exemplary method of forming a light-emitting display by use of aninkjet deposition process is found in reference to U.S. Pat. No.6,767,774, entitled, “Producing Multi-color Stable Light-EmittingOrganic Displays.” The '774 patent describes a polymer or organiclight-emitting display that may be formed on a substrate by patterningthe light-emitting material by use of a screen printing technique. Inthis way, displays may be formed economically and overcome thedifficulties associated with photoprocessing light-emitting materials. Abinary optic material may be selectively incorporated into sol gelcoatings and coated over light-emitting elements formed from thelight-emitting material. A tricolor display may be produced by use of alight-emitting material that produces a single color.

While the '774 patent describes a suitable method of forming alight-emitting display by use of an inkjet deposition process, it makesno mention of providing simpler or more inexpensive ways to form thereceptacle structures upon a substrate for use in the inkjet depositionprocess.

It is therefore an object of the invention to provide a simplified andinexpensive process for forming receptacles upon a display substrate foruse in a subsequent inkjet deposition process for forming a large-areaPLED/OLED display.

It is another object of this invention to provide a method of using ashadow mask vacuum deposition process for forming receptacles upon adisplay substrate for use in a subsequent inkjet deposition process.

BRIEF SUMMARY OF THE INVENTION

The present invention relates to evaporated receptacles for inkjetdeposited PLED/OLED device and a method of making such devices. Inaccordance with one aspect of the invention, a light-emitting display ismade by forming a substrate with an electrode disposed thereon, forminga receptacle structure over the electrode via a shadow mask vacuumdeposition process, and delivering a quantity of polymeric solution,which contains a light-emitting material, into the receptacle via astandard inkjet deposition process.

The present invention avoids the use of a complex and costlyphotolithography process for forming the receptacles upon the displaysubstrate. As a result, the combination of using a shadow mask vacuumdeposition process to form the inkjet receptacles and the use of aninkjet deposition process to deliver the light-emitting materialprovides a less complex and more cost-effective way to make polymerdisplays of any desired dimension.

Other features and advantages of the present invention will become moreapparent from the detailed description of exemplary embodiments providedbelow with reference to the accompanying drawings in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a top view of a picture element in accordance with afirst embodiment of the invention.

FIG. 2 illustrates an example light-emitting display formed of aplurality of picture elements of the present invention.

FIG. 3A illustrates a cross-sectional view of the picture element of thepresent invention taken along line A-A of FIG. 1.

FIG. 3B illustrates a cross-sectional view of the picture element of thepresent invention taken along line B-B of FIG. 1.

FIG. 4 illustrates a top view of an exemplary shadow mask for forming anarrangement of receptacle cross segments via a shadow mask vacuumdeposition process in accordance with a first embodiment of theinvention.

FIG. 5 illustrates a top view of an exemplary shadow mask for forming anarrangement of receptacle connecting segments via a shadow mask vacuumdeposition process in accordance with a first embodiment of theinvention.

FIG. 6 illustrates a top view of a picture element in accordance with asecond embodiment of the invention.

FIG. 7 illustrates a top view of an exemplary shadow mask for forming anarrangement of receptacle cross segments via a shadow mask vacuumdeposition process in accordance with a second embodiment of theinvention.

FIG. 8 illustrates a top view of an exemplary shadow mask for forming anarrangement of receptacle connecting segments via a shadow mask vacuumdeposition process in accordance with a second embodiment of theinvention.

FIG. 9 illustrates a flow diagram of a method of making inkjetreceptacles via a shadow mask vacuum deposition process and using samein accordance with the invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 illustrates a top view of a picture element 100 in accordancewith a first embodiment of the invention. Picture element 100 is arepresentative pixel of a flat-panel display, such as a PLED or OLEDdisplay. Picture element 100 includes a substrate 110 upon which isformed a receptacle 112. Receptacle 112 is formed by an arrangement ofevaporated segments. Receptacle 112 is formed of a plurality of crosssegments 114 arranged on a grid that are interconnected via a pluralityof connecting segments 116 and connecting segments 118, which form thewalls of receptacle 112 for retaining liquid solvent during an inkjetdeposition process.

In this example, receptacle 112 is formed of a cross segment 114 a, across segment 114 b, a cross segment 114 c, and a cross segment 114 d,arranged on a grid as shown in FIG. 1. Cross segments 114 a and 114 bare interconnected via a connecting segment 116 a to form a first wallof receptacle 112; cross segments 114 c and 114 d are interconnected viaa connecting segment 116 b to form a second wall of receptacle 112;cross segments 114 a and 114 c are interconnected via a connectingsegment 118 a to form a third wall of receptacle 112; and cross segments114 b and 114 d are interconnected via a connecting segment 118 b toform a fourth wall of receptacle 112.

Deposited within the walls of receptacle 112 that are formed by thecombination of cross segments 114, connecting segments 116, andconnecting segments 118 is a quantity of emissive medium 120.

Substrate 110 is formed of any standard substrate material that issuited for a shadow mask evaporation process, such as metal foil,plastic, or glass.

Cross segments 114, connecting segments 116, and connecting segments 118of receptacle 112 are formed of via a shadow mask evaporation process.The material for forming cross segments 114, connecting segments 116,and connecting segments 118 is an organic hydrophobic material that issuited for use with an inkjet deposition process and also suited for usewith a shadow mask evaporation manufacturing process. While the literaldefinition of the word “hydrophobic” is roughly to repel water, for thepurposes of this disclosure “hydrophobic” shall mean that theadhesiveness to a polymeric solution, which contains a light-emittingmaterial, is low (affinity). By contrast, while the literal definitionof the word “hydrophilic” is roughly to attract water, for the purposesof this disclosure “hydrophilic” shall mean that the adhesiveness to apolymeric solution, which contains a light-emitting material, is high(affinity). Both expressions are used for the sake of convenience as acomparison to clarify the degree of affinity against the polymericsolution.

Examples of organic hydrophobic materials for forming cross segments114, connecting segments 116, and connecting segments 118 of receptacle112 are (poly) vinyl alcohol, (poly)acrylate or polyimide. The designobjective is for the solid material forming cross segments 114,connecting segments 116, and connecting segments 118 of receptacle 112to have a surface energy higher than the surface tension of thepolymeric solution deposited therein and, thus, the structure formingreceptacle 112 repels the polymeric solution. Further details of theformation of cross segments 114, connecting segments 116, and connectingsegments 118 of receptacle 112 via the shadow mask evaporation processare found in reference to FIGS. 4 and 5.

Emissive medium 120 is representative of a light emissive solid polymerlayer that is deposited via a standard inkjet process whereby a volumeof solvent with polymeric material dissolved therein is deposited withinreceptacle 112 and allowed to dry, which leaves only a solid layer oflight emissive material. Commercially available polymeric solvents are,for example, Xylene; Toluene; benzene compounds, such astrimethylbenzene, chlorobenzene; dichlorobenzene supplied by ShellChemical Corporation (Houston, Tex.); or proprietary mixtures includingthese chemicals, such as supplied by Dow Corning Corporation (Midland,Mich.).

FIG. 2 illustrates an example of a light-emitting display 200 formed ofa plurality of picture elements 100, as described in FIG. 1. Receptacles112 of picture elements 100 are formed upon substrate 110 via a shadowmask vacuum deposition process. Subsequently, emissive medium 120 isdeposited within receptacles 112 via a standard inkjet process in orderto complete the formation of light-emitting display 200. Further detailsof the inkjet process are found in reference to FIGS. 3A and 3B.

FIG. 3A illustrates a cross-sectional view of picture element 100 takenalong line A-A of FIG. 1. Cross segments 114 c and 114 d and connectingsegment 116 b are deposited atop an electrode 122, which is a portion ofthe circuitry of picture element 100 that is deposited atop substrate110. Cross segments 114 c and 114 d are interconnected with connectingsegment 116 b to form a continuous wall of receptacle 112. Connectingsegment 116 b is deposited, such that it overlaps slightly atop crosssegment 114 c on one end and overlaps slightly atop cross segment 114 don its opposing end, so that it fills the gap between cross segments 114c and 114 d in order to form a continuous wall, as shown in FIG. 3A.

Electrode 122 is formed of an electrically conductive hydrophilicmaterial, such as indium-tin oxide (ITO), as commonly used in bottomemitting PLED displays, or metal, such as nickel covered with a thin(5-50 angstrom thickness) nickel oxide formed by exposure of the nickelfilm to plasma in the presence of oxygen. The design objective is forthe solid material forming electrode 122 to have a surface energy lowerthan the surface tension of the polymeric solution deposited thereonand, thus, electrode 122 attracts the polymeric solution.

FIG. 3B illustrates a cross-sectional view of picture element 100 takenalong line B-B of FIG. 1. FIG. 3B shows that emissive medium 120 isbounded by the well structure of receptacle 112 that is formed by thecombination of cross segments 114, connecting segment 116, andconnecting segments 118. FIG. 3B further shows receptacle 112 filledwith a solution 124, which is representative of a polymeric solution, asdescribed in reference to FIG. 1.

For simplicity FIGS. 3A and 3B are shown without the electronic activematrix circuit, which is typically positioned between electrode 122 andsubstrate 110.

With reference to FIGS. 1, 2, 3A, and 3B, cross segments 114, connectingsegments 116, and connecting segments 118 of receptacle 112, are formedvia a shadow mask evaporation system, such as described in reference toU.S. Patent Application No. 2003/0228715, entitled, “Active MatrixBackplane for Controlling Controlled Elements and Method of ManufactureThereof,” assigned to Amedeo Corporation (Pittsburgh, Pa.), which isincorporated herein by reference. The '715 patent application describesan electronic device formed from electronic elements deposited on asubstrate. The electronic elements are deposited on the substrate by theadvancement of the substrate through a plurality of deposition vacuumvessels that have at least one material deposition source and a shadowmask positioned therein. The material from at least one materialdeposition source positioned in each deposition vacuum vessel isdeposited on the substrate through the shadow mask that is positioned inthe deposition vacuum vessel, in order to form on the substrate acircuit formed of an array of electronic elements. The circuit is formedsolely by the successive deposition of materials on the substrate.

Cross segments 114, connecting segments 116, and connecting segments 118of receptacle 112 are formed with a thickness of, for example, 2 micronsand with a width as is practical, depending on the pitch of pictureelements 100 upon substrate 110. For example, the width of the walls ofeach receptacle 112 formed by cross segments 114, connecting segments116, and connecting segments 118 may be in the range of 10 to 20micrometers.

With continuing reference to FIGS. 1, 2, 3A, and 3B, during a standardinkjet deposition process, a printhead sweeps across the area of atarget display, such as light-emitting display 200 of FIG. 2, anddelivers droplets of solution 124 of a predetermined volume into thereceptacles 112 thereof. By doing so, each receptacle 112 is filled orslightly overfilled to a uniform level with a predetermined quantity ofsolution 124, as shown in FIG. 3B. The droplets of solution 124 arerepelled by the hydrophobic material that forms the walls of eachreceptacle 112, while, at the same time, the droplets of solution 124are pulled into each receptacle 112 by the surface energy of thehydrophilic material of electrode 122. In this way, each droplet ofsolution 124 is drawn to its intended location within each pictureelement 100 of the target display, such as light-emitting display 200 ofFIG. 2. The display then experiences a drying event, whereby the liquidwithin solution 124 evaporates and leaves behind only the solids withinsolution 124 as a thin, solid, uniform layer of emissive material, i.e.,emissive medium 120.

FIG. 4 illustrates a top view of an exemplary shadow mask 400 forforming an arrangement of cross segments 114 of a plurality ofreceptacles 112 via a shadow mask vacuum deposition process inaccordance with a first embodiment of the invention. Shadow mask 400includes a sheet 410 formed of, for example, nickel, chromium, steel,copper, Kovar, or Invar. Kovar and Invar are materials with a lowcoefficient of thermal expansion (CTE) known commercially as KOVAR™ orINVAR™ and are supplied, for example, by ESPICorp Inc. (Ashland, Oreg.).Formed within sheet 410 is a pattern of apertures 412, which areopenings of a predetermined size, shape, and location, for forming anarrangement of cross segments 114. With reference to FIGS. 1 and 4,shadow mask 400 includes, for example, an aperture 412 a for formingcross segment 114 a, an aperture 412 b for forming cross segment 114 b,an aperture 412 c for forming cross segment 114 c, and an aperture 412 dfor forming cross segment 114 d.

The location of apertures 412 are set on a pitch, as determined by anassociated layout of picture elements 100 for a given display design.More specifically, the pitch of apertures 412 is dependent on the numberof pixels per inch of a given display design. For example, the pitch ofapertures 412 may be in the range of 100 to 500 μm, which equates to 250to 50 pixels per inch, respectively.

Shadow mask 400 is suitable for use in a vacuum vessel of one depositionstage of an evaporation system. An example of a shadow mask evaporationsystem and method for forming cross segments 114, connecting segments116, and connecting segments 118 of receptacle 112 is described inreference to the '715 patent application.

Optionally, one or more shadow masks, such as shadow mask 400, in one ormore successive deposition stages, respectively, of an evaporationprocess may be required for forming the full arrangement of crosssegments 114 for any given display design, depending on the pitch of thedesign. The requirement is that the structural integrity and strength ofthe shadow masks, such as shadow mask 400, be suitably maintained withany given layout of apertures 412.

FIG. 5 illustrates a top view of an exemplary shadow mask 500 forforming an arrangement of connecting segments 116 and connectingsegments 118 of a plurality of receptacles 112 via a shadow mask vacuumdeposition process in accordance with a first embodiment of theinvention. Shadow mask 500 includes a sheet 510 formed of, for example,nickel, chromium, steel, copper, Kovar, or Invar. Formed within sheet510 is a pattern of apertures 516 and apertures 518, which are openingsof a predetermined size, shape, and location, for forming an arrangementof connecting segments 116 and 118, respectively. With reference toFIGS. 1 and 5, shadow mask 500 includes, for example, an aperture 516 afor forming connecting segment 116 a, an aperture 516 b for formingconnecting segment 116 b, an aperture 518 a for forming connectingsegment 118 a, and an aperture 518 b for forming connecting segment 118b.

The location of apertures 516 and 518 are set on a pitch, as determinedby an associated layout of picture elements 100 for a given displaydesign. More specifically, the pitch of apertures 516 and 518 isdependent on the number of pixels per inch of a given display design.For example, the pitch of apertures 516 and 518 may be in the range of100 to 500 μm, which equates to 250 to 50 pixels per inch, respectively.

Shadow mask 500 is suitable for use in a vacuum vessel of one depositionstage of an evaporation system. An example of a shadow mask evaporationsystem and method for forming cross segments 114, connecting segments116, and connecting segments 118 of receptacle 112 is described inreference to the '715 patent application.

Optionally, one or more shadow masks, such as shadow mask 500, in one ormore successive deposition stages, respectively, of an evaporationprocess may be required for forming the full arrangement of connectingsegments 116 and 118 for any given display design, depending on thepitch of the design, for example, a shadow mask that includes onlyapertures 516 and another shadow mask that includes only apertures 518.The requirement is that the structural integrity and strength of theshadow masks, such as shadow mask 500, be suitably maintained with anygiven layout of apertures 516 and/or apertures 518.

FIG. 6 illustrates a top view of a picture element 600 in accordancewith a second embodiment of the invention. Picture element 600 is arepresentative pixel of a flat-panel display, such as a PLED or OLEDdisplay. Picture element 600 includes substrate 110, upon which isformed a receptacle 612. Receptacle 612 is formed by an arrangement ofevaporated segments and is formed of a plurality of cross segments 614,arranged on a grid, that are interconnected via a plurality ofconnecting segments 616 and connecting segments 618, which form thewalls of receptacle 612 for retaining liquid solvent during an inkjetdeposition process.

In this example, receptacle 612 is formed of a cross segment 614 a, across segment 614 b, a cross segment 614 c, and a cross segment 614 d,arranged on a grid, as shown in FIG. 6. Cross segments 614 a and 614 bare interconnected via a connecting segment 616 a to form a first wallof receptacle 612; cross segments 614 c and 614 d are interconnected viaa connecting segment 616 b to form a second wall of receptacle 612;cross segments 614 a and 614 c are interconnected via a connectingsegment 618 a to form a third wall of receptacle 612; and cross segments614 b and 614 d are interconnected via a connecting segment 618 b toform a fourth wall of receptacle 612.

Deposited within the walls of receptacle 612 that are formed by thecombination of cross segments 614, connecting segments 616, andconnecting segments 618 is a quantity of emissive medium 120.

Cross segments 614, connecting segments 616, and connecting segments 618of receptacle 612 are formed via a shadow mask evaporation process. Thematerial for forming cross segments 614, connecting segments 616, andconnecting segments 618 is an organic hydrophobic material that issuited for use with an inkjet deposition process and also suited for usewith the shadow mask evaporation manufacturing process, as described inFIG. 1. Further details of the formation of cross segments 614,connecting segments 616, and connecting segments 618 of receptacle 612via the shadow mask evaporation process are found in reference to FIGS.7 and 8.

As compared with picture element 100 of FIG. 1, picture element 600illustrates an example alternative shape for a receptacle of a display.More specifically, picture element 100 of FIG. 1 results in emissivemedium 120 forming in a square shape, whereas picture element 600 ofFIG. 6 results in emissive medium 120 forming in a circular shape. Theshape of the receptacles of the present invention are not limited tosquare or circular; any desired shape or geometry, such as rectangular,square, circular, or oval, is within the scope of this invention.

FIG. 7 illustrates a top view of an exemplary shadow mask 700 forforming an arrangement of cross segments 614 of a plurality ofreceptacles 612 via a shadow mask vacuum deposition process inaccordance with a second embodiment of the invention. Shadow mask 700includes a sheet 710 formed of, for example, nickel, chromium, steel,copper, Kovar, or Invar. Formed within sheet 710 is a pattern ofapertures 712, which are openings of a predetermined size, shape, andlocation, for forming an arrangement of cross segments 614. Withreference to FIGS. 6 and 7, shadow mask 700 includes, for example, anaperture 712 a for forming cross segment 614 a, an aperture 712 b forforming cross segment 614 b, an aperture 712 c for forming cross segment614 c, and an aperture 712 d for forming cross segment 614 d.

The location of apertures 712 are set on a pitch, as determined by anassociated layout of picture elements 600 for a given display design.More specifically, the pitch of apertures 712 is dependent on the numberof pixels per inch of a given display design. For example, the pitch ofapertures 712 may be in the range of 100 to 500 μm, which equates to 250to 50 pixels per inch, respectively.

Shadow mask 700 is suitable for use in a vacuum vessel of one depositionstage of an evaporation system. An example shadow mask evaporationsystem and method for forming cross segments 614, connecting segments616, and connecting segments 618 of receptacle 612 is described inreference to the '715 patent application.

Optionally, one or more shadow masks, such as shadow mask 700, in one ormore successive deposition stages, respectively, of an evaporationprocess may be required for forming the full arrangement of crosssegments 614 for any given display design, depending on the pitch of thedesign. The requirement is that the structural integrity and strength ofthe shadow masks, such as shadow mask 700, be suitably maintained withany given layout of apertures 712.

FIG. 8 illustrates a top view of an exemplary shadow mask 800 forforming an arrangement of connecting segments 616 and connectingsegments 618 of a plurality of receptacles 612 via a shadow mask vacuumdeposition process in accordance with a second embodiment of theinvention. Shadow mask 800 includes a sheet 810 formed of, for example,nickel, chromium, steel, copper, Kovar, or Invar. Formed within sheet810 is a pattern of apertures 816 and apertures 818, which are openingsof a predetermined size, shape, and location, for forming an arrangementof connecting segments 616 and 618, respectively. With reference toFIGS. 6 and 8, shadow mask 800 includes, for example, an aperture 816 afor forming connecting segment 616 a, an aperture 816 b for formingconnecting segment 616 b, an aperture 818 a for forming connectingsegment 618 a, and an aperture 818 b for forming connecting segment 618b.

The location of apertures 816 and 818 are set on a pitch, as determinedby an associated layout of picture elements 600 for a given displaydesign. More specifically, the pitch of apertures 816 and 818 isdependent on the number of pixels per inch of a given display design.For example, the pitch of apertures 816 and 818 may be in the range of100 to 500 μm, which equates to 250 to 50 pixels per inch, respectively.

Shadow mask 800 is suitable for use in a vacuum vessel of one depositionstage of an evaporation system. An example shadow mask evaporationsystem and method for forming cross segments 614, connecting segments616, and connecting segments 618 of receptacle 612 is described inreference to the '715 patent application.

Optionally, one or more shadow masks, such as shadow mask 800, in one ormore successive deposition stages, respectively, of an evaporationprocess may be required for forming the full arrangement of connectingsegments 616 and 618 for any given display design, depending on thepitch of the design, for example, a shadow mask that includes onlyapertures 816 and another shadow mask that includes only apertures 818.The requirement is that the structural integrity and strength of theshadow masks, such as shadow mask 800, be suitably maintained with anygiven layout of apertures 816 and/or apertures 818. Additionally, thedeposition sequence of the receptacle components is not critical and canbe altered without material change to the resultant receptacles.

FIG. 9 illustrates a flow diagram of a method 900 of making inkjetreceptacles via a shadow mask vacuum deposition process and using samein accordance with the invention. With continuing reference to FIGS. 1through 8, method 900 includes the following steps.

At step 910, an arrangement of deposition vacuum vessels is installed ina serial arrangement to form a shadow mask vacuum deposition system,such as described in reference to the '715 patent application.

At step 912, the design specifications of the specific light emissivedisplay to be formed via the shadow mask vacuum deposition system aredetermined.

At step 914, a set of shadow masks, such as shadow masks 400, 500, 700,or 800, for forming receptacles, such as a plurality of receptacles 112or 612, suitable for use with an inkjet printing deposition process areformed. The plurality of apertures within each shadow mask is arrangedaccording to the predetermined pattern for each segment of thereceptacle structure.

At step 916, circuitry associated with the display is formed upon asubstrate, such as substrate 110, via any well-known manufacturingprocess. The outmost layer is an arrangement of electrodes, such aselectrodes 122, formed of an electrically conductive hydrophilicmaterial, as described in reference to FIG. 3A.

At step 918, an arrangement of receptacle structures is formed upon asubstrate, such as a plurality of receptacles 112 or 612 upon substrate110. The receptacles are formed via one or more shadow mask vacuumdeposition events by use of the set of shadow masks of step 914 withinthe shadow mask vacuum deposition system of step 910. More specifically,a hydrophobic material, as described in reference to FIG. 1, isdeposited upon the hydrophilic electrodes to form the structure of thereceptacles.

At step 920, a solution, such as solution 124, which is a solvent with apolymer dissolved therein, is deposited within the receptacles formed atstep 918 via a standard inkjet deposition process. During the inkjetdeposition process, a printhead sweeps across the area of the targetdisplay, such as light-emitting display 200 of FIG. 2, and deliversdroplets of solution 124 of a predetermined volume into the receptacles112 thereof. By doing so, each receptacle 112 is filled or slightlyoverfilled to a uniform level with a predetermined quantity of solution124, as shown in FIG. 3B. The droplets of solution 124 are repelled bythe hydrophobic material that form the walls of each receptacle 112,while, at the same time, the droplets of solution 124 are pulled intoeach receptacle 112 by the surface energy of the hydrophilic material ofelectrode 122. In this way, each droplet of solution 124 is drawn to itsintended location within each picture element 100 of the target display,such as light-emitting display 200 of FIG. 2. The display thenexperiences a drying event, whereby the liquid within solution 124evaporates and leaves behind only the solids within solution 124 as athin, solid, uniform layer of emissive material, i.e., emissive medium120. Method 900 ends.

Although the invention has been described in detail in connection withthe exemplary embodiments, it should be understood that the invention isnot limited to the above disclosed embodiments. Rather, the inventioncan be modified to incorporate any number of variations, alternations,substitutions, or equivalent arrangements not heretofore described, butwhich are commensurate with the spirit and scope of the invention.Accordingly, the invention is not limited by the foregoing descriptionor drawings, but is only limited by the scope of the appended claims.

1. A system for providing an electronic display assembly, comprising: asubstrate; at least one receptacle structure disposed over thesubstrate, the receptacle structure being formed by employing a shadowmask aligned with a surface of the substrate; and a light-emissivematerial contained in the receptacle structure.
 2. The system of claim1, wherein the receptacle structure has a predetermined configurationthat allows a predetermined volume of a light-emissive material to becontained within the receptacle structure.
 3. The system of claim 1,wherein the receptacle structure comprises a plurality of cross segmentsdisposed on a grid over the substrate, and a plurality of connectingsegments for interconnecting the cross segments.
 4. The system of claim1, wherein the light-emissive material is an inkjet depositedlight-emissive material.
 5. The system of claim 1, further comprising atleast one electrode disposed on the substrate and under the receptaclestructure.
 6. An electronic display assembly, comprising: a substrate;an electrode formed on the substrate; a plurality of receptaclesprovided over the substrate, the receptacles being formed by employingdeposition of material through a shadow mask aligned with a surface ofthe substrate; and an emissive medium provided within the plurality ofreceptacles formed by employing deposition through the shadow mask. 7.The electronic display assembly of claim 6, wherein the emissive mediumforms an active display element.
 8. The electronic display assembly ofclaim 7, wherein the active display element is a light-emitting device.9. An organic light-emitting diode, comprising: a substrate; anelectrode formed on the substrate; at least one receptacle provided overthe substrate, the at least one receptacle being formed by employingdeposition of material through a shadow mask aligned with a surface ofthe substrate; and a light emissive polymer provided within the at leastone receptacle formed by employing deposition through the shadow mask.10. A receptacle structure for containing a light-emissive material of alight-emitting display, the receptacle structure being formed by aprocess comprising the steps of: employing a first shadow mask providedin a first deposition vacuum vessel to deposit a first material over asubstrate and to thereby form a plurality of cross segments; andemploying a second shadow mask provided in a second deposition vacuumvessel to deposit a second material over the substrate and to therebyform a plurality of connecting segments for connecting the plurality ofcross segments.
 11. A method of forming an electronic device, comprisingthe steps of: providing a substrate having at least one electrode formedthereon; aligning at least one shadow mask with a surface of thesubstrate; and forming at least one receptacle structure on the surfaceof the substrate using the shadow mask.
 12. The method of claim 11,wherein the step of forming the receptacle structure on the surface ofthe substrate further comprises the steps of: advancing the substratethrough a plurality of deposition vacuum vessels, each deposition vacuumvessel having at least one material deposition source and a shadow maskposition therein; and depositing on the surface of the substrate thematerial from the material deposition source through the shadow mask toform on the surface of the substrate the receptacle structure.
 13. Themethod of claim 11 further comprising the step of providing alight-emissive material within the receptacle structure by inkjetdeposition.
 14. A method of forming a light-emitting display, comprisingthe steps of: providing a substrate having at least one electrode formedthereon; using a first shadow mask and a second shadow mask to form atleast one receptacle on the surface of the substrate; and inkjetdepositing a light-emissive material within the receptacle.
 15. Themethod of claim 14, wherein the step of using the first shadow mask andthe second shadow mask further comprises the steps of: advancing thesubstrate through first and second deposition vacuum vessels, the firstdeposition vacuum vessel having a first material deposition source andthe first shadow mask positioned therein, and the second depositionvacuum vessel having a second material deposition source and the secondshadow mask positioned therein; and depositing on the surface of thesubstrate the first material from the first material deposition sourcethrough the first shadow mask to form on the surface of the substrate afirst pattern of segments of the receptacle.
 16. The method of claim 15further comprising the step of depositing on the surface of thesubstrate the second material from the second material deposition sourcethrough the second shadow mask to form on the surface of the substrate asecond pattern of segments of the receptacle.
 17. The method of claim16, wherein the first pattern of segments corresponds to a plurality ofcross segments provided on the surface of the substrate, and wherein thesecond pattern of segments corresponds to a plurality of interconnectsfor interconnecting the plurality of cross segments.